MediaTek has updated its 7000 series with a chip that can boast many things that its top of the range has, the Dimensity 9200. We are talking about the new MediaTek Dimensity 7200, a real gem for the mid-range.
As a report published on the website of Digital Trendsthe Taiwanese company has worked with chip foundry TSMC to make the Dimensity 7200 using a 4nm process, the same second-generation process used to make the Dimensity 9200. This means it should receive many of the same power and efficiency boosts that make the high-end stand out.
This new Dimensity 7200 is an octa-core chip based on two ARM Cortex A715 cores running at 2.8GHz, six ARM Cortex A510 cores, and the same MediaTek AI Processing Unit (APU) used in the Dimensity 9200.
Graphics are managed by the Mali G610 graphics processing (GPU) and it’s MediaTek’s own Imagiq 765 Image Signal Processor (ISP) that handles the camera.
Finally, MediaTek’s HyperEngine 5.0, a staple feature in its high-end chips since Dimensity 9000, works behind the scenes to reduce latency, improve CPU and GPU responsiveness, and increase power efficiency when gaming.
The chip supports cameras up to 200 megapixels and features like dual capture, where two cameras can operate simultaneously. It also supports low-light noise reduction, AI-powered image enhancements, plus portrait mode beauty settings.
On the display side, the Dimensity 7200 manages to pack in HDR10+ certification, Dolby HDR, support for refresh rates up to 144Hz, and resolutions up to Full HD+. Additionally, the chip connects to Sub-6 5G networks and supports Wi-Fi 6E and Bluetooth 5.3.
MediaTek claims that the chip is already in production, ready to ship, and expects the first smartphones with the processor to arrive before the last days of March 2023.